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VIS completes the acquisition of 8 inch Fab of Winbond Electronics Corp.
VIS completes the acquisition of 8 inch Fab of Winbond Electronics Corp.


Vanguard International Semiconductor Corporation ( VIS ) announced to complete the acquisition of the Fab 4 & Fab 5 of Winbond Electronics Corp¡Anewly named VIS Fab2, located in Hsinchu Science Park on January 1, 2008. With this acquisition, VIS will significantly expand its 8-inch wafers output to become 1,300,000 wafers per year by the rated capacity of VIS Fab 1 & Fab 2.

Mr. C.S. Hsu, president of VIS noted that¡AWe are thrilled to see this transaction successfully completed¡A and appreciate the efforts and arrangement of both VIS and Winbond during the transition period. Looking forward, the foundry model of the two companies will bring mutual benefit to both.

VIS spokesperson Mr. Robert Hsieh said, ¡§With the join of Fab2 , VIS reinforces the long term cooperation with its customers of Driver IC as well as HV¡Aand offers more opportunity for the mutual growth of VIS and all its customers. In addition, VIS can take Fab2 advantage to fast move forward its core technology up to 0.18~0.13 um¡Awhich will accordingly strengthen company's technology edge and expend service domain to secure VIS continuous growth momentum.





 
VIS Spokesperson¡G
Robert Hsieh- Vice President
Vanguard International Semiconductor Corporation
Tel: 886-3-5770355
E-mail: pr@vis.com.tw

Media Contacts¡G
Jay Tsai / Lily Hsu - PR Department
Vanguard International Semiconductor Corporation
Tel: 886-3-5770355 ext.1900 / 1901
Fax: 886-3-5773504
Mobil: 0910-296-018
E-mail: cjtsai@vis.com.tw, llhsu@vis.com.tw